Ultra-compact high transmittance photonic wire bends for monolithic integration on III/V-semiconductors

Ch. Schuller*, Sven Höfling, A. Forchel, C. Etrich, R. Iliew, F. Lederer, T. Pertsch, J. P. Reithmaier

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

2 Citations (Scopus)

Abstract

Using deeply etched photonic wires on gallium arsenide, ultra-small bent waveguides with radii of curvature below 1 mu m were fabricated. The maximum transmittance of a 90 degrees bend with radius of 2 mu m can be enhanced to almost 99% at a wavelength of 1.55 mu m, which corresponds to an attenuation factor of 0.05 dB per bend.

Original languageEnglish
Pages (from-to)1280-1281
Number of pages2
JournalElectronics Letters
Volume42
Issue number22
DOIs
Publication statusPublished - 26 Oct 2006

Keywords

  • WAVE-GUIDES
  • TRANSMISSION
  • RESONATORS

Fingerprint

Dive into the research topics of 'Ultra-compact high transmittance photonic wire bends for monolithic integration on III/V-semiconductors'. Together they form a unique fingerprint.

Cite this