Topological impact on latency and throughput: 2D versus 3D NoC comparison

NoC has emerged as an efficient communication infrastructure to fulfill the heavy communication requirements of several applications, which are implemented on MPSoC target architectures. 2D NoCs are natural choices of communication infrastructure for the majority of actual chip fabrication technologies. However, wire delay and power consumption are dramatically increasing even when using this kind of topology. In this sense, 3D NoC emerges as an improvement of 2D NoC aiming to reduce the length and number of global interconnections. This work explores architectural impacts of 2D and 3D NoC topologies on latency, throughput and network occupancy. We show that, in average, 3D topologies minimize 30% the application latency and increase 56% the packets throughput, when compared to 2D topologies. In addition, the paper explores the influence of the buffer length on communication architecture latency and on application latency, highlighting that when applying an appropriate buffer length the application latency is reduced up to 3.4 times for 2D topologies and 2.3 times for 3D topologies.