The use of H-bonding to increase the dimensionality of coordination networks of Cu(I) and Cu(II)

David B. Cordes, Lyall R. Hanton, Mark D. Spicer

Research output: Contribution to journalSpecial issuepeer-review

8 Citations (Scopus)

Abstract

Two two-dimensional coordination networks were prepared by the reaction of a bent bridging ligand, bis(4-pyridyl)amine (bpa), with CuI and CuCl2. Both networks were formed by bpa ligands bridging between Cu2I2 dimers or six-coordinate trans CuCl2 moieties. The networks were isotopological and displayed (4, 4) topology with nodes based on the midpoint of the Cu2I2 dimer or the Cu(II) ion, respectively. Reaction of a monoprotonated bpa ligand with CuSO4 resulted in the formation of a neutral discrete complex. H-bonding networks were formed in all three cases. The two coordination polymers were both extended to give related three-dimensional networks with the resulting CuI H-bonded network displaying twofold interpenetration. The discrete neutral complex formed a two-dimensional H-bonded network and when further H-bonding to H2O solvent molecules was considered, a highly complex three-dimensional network resulted with five different nodes of four different connectivities.

Original languageEnglish
Pages (from-to)146-159
Number of pages14
JournalJournal of Molecular Structure (Theochem)
Volume796
Early online date5 Jun 2006
DOIs
Publication statusPublished - Aug 2006

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