The interaction of sublimed iminodiacetic acid with a Cu{110} surface

D. Tee, S. M. Francis, Neville Vincent Richardson, C. Reid, L. McGhee

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Iminodiacetic acid (IMDA), NH(CH2CO2H)2, whose molecular structure is shown in figure 1, is a small molecule but has a very large scope for interacting with copper due to its two carboxylic acid and imine functionalities, which have been shown to bind strongly to copper [1,2,3]. The electronegative oxygen and nitrogen atoms present also make this a good candidate for hydrogen bonding, which often leads to very stable ordered two dimensional (2D) structures being formed across surfaces.
Original languageEnglish
Title of host publicationUltra clean processing of semiconductor surfaces IX: UCPSS : 9th international symposium on ultra clean processing of semiconductor surfaces (UCPSS) held in Bruges, Belgium, September 22-24 2008
EditorsP. Mertens, M. Meuris, M. Heyns
PublisherTrans Tech Publications
Pages335-338
Number of pages4
DOIs
Publication statusPublished - 2009
Event9th International Symposium on Ultra Clean Processing of Semiconductor Surfaces (UCPSS) - Bruges, Belgium
Duration: 22 Sept 200824 Sept 2008

Publication series

NameSolid State Phenomena
Volume145-146
ISSN (Print)1012-0394

Conference

Conference9th International Symposium on Ultra Clean Processing of Semiconductor Surfaces (UCPSS)
Country/TerritoryBelgium
CityBruges
Period22/09/0824/09/08

Keywords

  • iminodiacetic acid
  • copper surface
  • scanning tunneling microscopy
  • FTIR
  • surface cleaning
  • passivation
  • ADSORPTION

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