@inproceedings{cb3829cba5aa412bbefda5d7d256cb57,
title = "The interaction of sublimed iminodiacetic acid with a Cu{110} surface",
abstract = "Iminodiacetic acid (IMDA), NH(CH2CO2H)2, whose molecular structure is shown in figure 1, is a small molecule but has a very large scope for interacting with copper due to its two carboxylic acid and imine functionalities, which have been shown to bind strongly to copper [1,2,3]. The electronegative oxygen and nitrogen atoms present also make this a good candidate for hydrogen bonding, which often leads to very stable ordered two dimensional (2D) structures being formed across surfaces.",
keywords = "iminodiacetic acid, copper surface, scanning tunneling microscopy, FTIR, surface cleaning, passivation, ADSORPTION",
author = "D. Tee and Francis, {S. M.} and Richardson, {Neville Vincent} and C. Reid and L. McGhee",
year = "2009",
doi = "10.4028/www.scientific.net/SSP.145-146.335",
language = "English",
series = "Solid State Phenomena",
publisher = "Trans Tech Publications",
pages = "335--338",
editor = "P. Mertens and M. Meuris and M. Heyns",
booktitle = "Ultra clean processing of semiconductor surfaces IX: UCPSS : 9th international symposium on ultra clean processing of semiconductor surfaces (UCPSS) held in Bruges, Belgium, September 22-24 2008",
address = "Germany",
note = "9th International Symposium on Ultra Clean Processing of Semiconductor Surfaces (UCPSS) ; Conference date: 22-09-2008 Through 24-09-2008",
}