The integration of EWOD and SAW technologies for improved droplet manipulation and mixing

Y. Li; B. W. Flynn; W. Parkes; Y. Liu; Y. Feng; A. D. Ruthven; J. G. Terry; L. I. Haworth; A. Bunting; J. T.M. Stevenson; S. Smith; P. Bobbili; Y. Q. Fu; A. J. Walton

doi:10.1109/ESSDERC.2009.5331396

The integration of EWOD and SAW technologies for improved droplet manipulation and mixing

Y. Li^*, B. W. Flynn, W. Parkes, Y. Liu, Y. Feng, A. D. Ruthven, J. G. Terry, L. I. Haworth, A. Bunting, J. T.M. Stevenson, S. Smith, P. Bobbili, Y. Q. Fu, A. J. Walton

^*Corresponding author for this work

School of Physics and Astronomy

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

This paper details the first reported integration of two advanced digital microfluidic technologies where 100 μm silicon cubes are transported with ElectroWetting On Dielectric (EWOD) and the droplet then held with EWOD while the silicon cubes are mixed with another liquid using a Surface Acoustic Wave (SAW). Together these two technologies provide a comprehensive lab-on-a-chip combination with well developed functionalities. These include droplet generation, splitting and transportation offered by EWOD with transportation, mixing and biosensing being potentially available with SAW. The fabrication of both EWOD and SAW structures on LiNb0₃ substrates used low temperature Ta/Ta₂O₅/CYTOP layer deposition and patterning technologies, which enabled efficient transportation and mixing functions to be demonstrated.

Original language	English
Title of host publication	ESSDERC 2009 - Proceedings of the 39th European Solid-State Device Research Conference
Pages	371-374
Number of pages	4
DOIs	https://doi.org/10.1109/ESSDERC.2009.5331396
Publication status	Published - 1 Dec 2009
Event	39th European Solid-State Device Research Conference, ESSDERC 2009 - Athens, Greece Duration: 14 Sept 2009 → 18 Sept 2009

Conference

Conference	39th European Solid-State Device Research Conference, ESSDERC 2009
Country/Territory	Greece
City	Athens
Period	14/09/09 → 18/09/09

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10.1109/ESSDERC.2009.5331396

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Li, Y., Flynn, B. W., Parkes, W., Liu, Y., Feng, Y., Ruthven, A. D., Terry, J. G., Haworth, L. I., Bunting, A., Stevenson, J. T. M., Smith, S., Bobbili, P., Fu, Y. Q., & Walton, A. J. (2009). The integration of EWOD and SAW technologies for improved droplet manipulation and mixing. In ESSDERC 2009 - Proceedings of the 39th European Solid-State Device Research Conference (pp. 371-374). Article 5331396 https://doi.org/10.1109/ESSDERC.2009.5331396

@inproceedings{59fee0020f5140299393ef8a012931e6,

title = "The integration of EWOD and SAW technologies for improved droplet manipulation and mixing",

abstract = "This paper details the first reported integration of two advanced digital microfluidic technologies where 100 μm silicon cubes are transported with ElectroWetting On Dielectric (EWOD) and the droplet then held with EWOD while the silicon cubes are mixed with another liquid using a Surface Acoustic Wave (SAW). Together these two technologies provide a comprehensive lab-on-a-chip combination with well developed functionalities. These include droplet generation, splitting and transportation offered by EWOD with transportation, mixing and biosensing being potentially available with SAW. The fabrication of both EWOD and SAW structures on LiNb03 substrates used low temperature Ta/Ta2O5/CYTOP layer deposition and patterning technologies, which enabled efficient transportation and mixing functions to be demonstrated.",

author = "Y. Li and Flynn, {B. W.} and W. Parkes and Y. Liu and Y. Feng and Ruthven, {A. D.} and Terry, {J. G.} and Haworth, {L. I.} and A. Bunting and Stevenson, {J. T.M.} and S. Smith and P. Bobbili and Fu, {Y. Q.} and Walton, {A. J.}",

year = "2009",

month = dec,

day = "1",

doi = "10.1109/ESSDERC.2009.5331396",

language = "English",

isbn = "9781424443536",

pages = "371--374",

booktitle = "ESSDERC 2009 - Proceedings of the 39th European Solid-State Device Research Conference",

note = "39th European Solid-State Device Research Conference, ESSDERC 2009 ; Conference date: 14-09-2009 Through 18-09-2009",

}

Li, Y, Flynn, BW, Parkes, W, Liu, Y, Feng, Y, Ruthven, AD, Terry, JG, Haworth, LI, Bunting, A, Stevenson, JTM, Smith, S, Bobbili, P, Fu, YQ & Walton, AJ 2009, The integration of EWOD and SAW technologies for improved droplet manipulation and mixing. in ESSDERC 2009 - Proceedings of the 39th European Solid-State Device Research Conference., 5331396, pp. 371-374, 39th European Solid-State Device Research Conference, ESSDERC 2009, Athens, Greece, 14/09/09. https://doi.org/10.1109/ESSDERC.2009.5331396

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AU - Li, Y.

AU - Flynn, B. W.

AU - Parkes, W.

AU - Liu, Y.

AU - Feng, Y.

AU - Ruthven, A. D.

AU - Terry, J. G.

AU - Haworth, L. I.

AU - Bunting, A.

AU - Stevenson, J. T.M.

AU - Smith, S.

AU - Bobbili, P.

AU - Fu, Y. Q.

AU - Walton, A. J.

PY - 2009/12/1

Y1 - 2009/12/1

N2 - This paper details the first reported integration of two advanced digital microfluidic technologies where 100 μm silicon cubes are transported with ElectroWetting On Dielectric (EWOD) and the droplet then held with EWOD while the silicon cubes are mixed with another liquid using a Surface Acoustic Wave (SAW). Together these two technologies provide a comprehensive lab-on-a-chip combination with well developed functionalities. These include droplet generation, splitting and transportation offered by EWOD with transportation, mixing and biosensing being potentially available with SAW. The fabrication of both EWOD and SAW structures on LiNb03 substrates used low temperature Ta/Ta2O5/CYTOP layer deposition and patterning technologies, which enabled efficient transportation and mixing functions to be demonstrated.

AB - This paper details the first reported integration of two advanced digital microfluidic technologies where 100 μm silicon cubes are transported with ElectroWetting On Dielectric (EWOD) and the droplet then held with EWOD while the silicon cubes are mixed with another liquid using a Surface Acoustic Wave (SAW). Together these two technologies provide a comprehensive lab-on-a-chip combination with well developed functionalities. These include droplet generation, splitting and transportation offered by EWOD with transportation, mixing and biosensing being potentially available with SAW. The fabrication of both EWOD and SAW structures on LiNb03 substrates used low temperature Ta/Ta2O5/CYTOP layer deposition and patterning technologies, which enabled efficient transportation and mixing functions to be demonstrated.

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DO - 10.1109/ESSDERC.2009.5331396

M3 - Conference contribution

AN - SCOPUS:72849125130

SN - 9781424443536

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BT - ESSDERC 2009 - Proceedings of the 39th European Solid-State Device Research Conference

T2 - 39th European Solid-State Device Research Conference, ESSDERC 2009

Y2 - 14 September 2009 through 18 September 2009

ER -

The integration of EWOD and SAW technologies for improved droplet manipulation and mixing

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