Test structures for characterizing the integration of EWOD and SAW technologies for microfluidics

Yifan Li*, Richard Yongqing Fu, D. Winters, Brian W. Flynn, Bill Parkes, Douglas Stuart Brodie, Yufei Liu, Jonathan Terry, Les I. Haworth, A. S. Bunting, J. T.M. Stevenson, Stewart Smith, C. Logan MacKay, Pat R.R. Langridge-Smith, Adam A. Stokes, Anthony J. Walton

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

6 Citations (Scopus)

Abstract

This paper presents details of the design and fabrication of test structures specifically designed for the characterization of two distinct digital microfluidic technologies: electro-wetting on dielectric (EWOD) and surface acoustic wave (SAW). A test chip has been fabricated that includes structures with a wide range of dimensions and provides the capability to characterize enhanced droplet manipulation, as well as other integrated functions. The EWOD and SAW devices have been separately characterized first of all to determine whether integration of the technologies affects their individual performance, including device lifetime evaluation. Microfluidic functions have then been demonstrated, including combined EWOD/SAW functions. In particular, this paper details the use of EWOD to anchor droplets, while SAW excitation is applied to perform mixing. The relationship between test structure designs and the droplets anchoring performance has been studied.

Original languageEnglish
Article number6212373
Pages (from-to)323-330
Number of pages8
JournalIEEE Transactions on Semiconductor Manufacturing
Volume25
Issue number3
DOIs
Publication statusPublished - 13 Aug 2012

Keywords

  • Contact angle
  • electro-wetting on dielectric (EWOD)
  • integration
  • surface acoustic wave (SAW)
  • test structure

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