TY - GEN
T1 - On-chip nano-localization via transverse kerker scattering
AU - Bag, A.
AU - Neugebauer, M.
AU - Mick, U.
AU - Christiansen, S.
AU - Schulz, S.A.
AU - Banzer, P.
N1 - This work was supported by the European Commission Horizon 2020 research and innovation program under the Future and Emerging Technologies Open Grant Agreement Super-Pixels No. 829116.
PY - 2020/9/14
Y1 - 2020/9/14
N2 - Here we present a transverse Kerker scattering based sub-wavelength localization technique transferred to a chip-scale all-optical displacement sensing device, which could act as a metrological instrument in modern lithography and microscopy, or monitor system drifts.
AB - Here we present a transverse Kerker scattering based sub-wavelength localization technique transferred to a chip-scale all-optical displacement sensing device, which could act as a metrological instrument in modern lithography and microscopy, or monitor system drifts.
UR - https://www.osapublishing.org/abstract.cfm?URI=FiO-2020-FW1B.5#videoPlayer
UR - https://www.scopus.com/pages/publications/85105990601
U2 - 10.1364/FIO.2020.FW1B.5
DO - 10.1364/FIO.2020.FW1B.5
M3 - Conference contribution
SN - 9781557528209
T3 - OSA Technical Digest
BT - Frontiers in Optics/Laser Science 2020
PB - Optical Society of American (OSA)
T2 - 2020 Frontiers in Optics Conference (FiO 2020)
Y2 - 14 September 2020 through 17 September 2020
ER -