Integration of IC technology with MEMS: Silicon + technology for the future

A. J. Walton, J. T.M. Stevenson, I. Underwood, J. G. Terry, S. Smith, W. Parkes, C. Dunare, H. Lin, Y. Li, R. Henderson, D. Renshaw, K. Muir, M. Desmulliez, D. Flynn, M. J. MacIntosh, W. S. Holland, A. F. Murray, T. B. Tang, A. Bunting, A. M. Gundlach

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