Integration of IC technology with MEMS: Silicon 
                        +
                         technology for the future

A. J. Walton; J. T.M. Stevenson; I. Underwood; J. G. Terry; S. Smith; W. Parkes; C. Dunare; H. Lin; Y. Li; R. Henderson; D. Renshaw; K. Muir; M. Desmulliez; D. Flynn; M. J. MacIntosh; W. S. Holland; A. F. Murray; T. B. Tang; A. Bunting; A. M. Gundlach

Integration of IC technology with MEMS: Silicon ⁺ technology for the future

A. J. Walton, J. T.M. Stevenson, I. Underwood, J. G. Terry, S. Smith, W. Parkes, C. Dunare, H. Lin, Y. Li, R. Henderson, D. Renshaw, K. Muir, M. Desmulliez, D. Flynn, M. J. MacIntosh, W. S. Holland, A. F. Murray, T. B. Tang, A. Bunting, A. M. Gundlach

School of Physics and Astronomy

Research output: Contribution to conference › Paper › peer-review

Abstract

As silicon integrated circuits (ICs) continue their development scaling to smaller geometries there are increasing signs that the industry is diversifying into new device types and associated new application areas. The mainstream IC industry which is manufacturing devices such as memories and microprocessors will be following the ITRS roadmap towards smaller and smaller devices. However, in parallel, there will be an increasing activity involving the integration of silicon with other technologies and new materials, and it is clear that MEMS will form an important component of this Silicon+ activity. This paper identifies the options available for integrating MEMS with IC technology and examples will be used to identify the issues associated with their implementation through a number of examples.

Original language	English
Publication status	Published - 1 Jan 2007
Event	IET Seminar on Micro-Electro-Mechanical (MEMS) Technology 2007 - London, United Kingdom Duration: 25 Apr 2007 → 25 Apr 2007

Conference

Conference	IET Seminar on Micro-Electro-Mechanical (MEMS) Technology 2007
Country/Territory	United Kingdom
City	London
Period	25/04/07 → 25/04/07

Cite this

Walton, A. J., Stevenson, J. T. M., Underwood, I., Terry, J. G., Smith, S., Parkes, W., Dunare, C., Lin, H., Li, Y., Henderson, R., Renshaw, D., Muir, K., Desmulliez, M., Flynn, D., MacIntosh, M. J., Holland, W. S., Murray, A. F., Tang, T. B., Bunting, A., & Gundlach, A. M. (2007). Integration of IC technology with MEMS: Silicon ⁺ technology for the future. Paper presented at IET Seminar on Micro-Electro-Mechanical (MEMS) Technology 2007, London, United Kingdom.

@conference{3f36f264a6114aaaabc2740e96245bab,

title = "Integration of IC technology with MEMS: Silicon + technology for the future",

abstract = "As silicon integrated circuits (ICs) continue their development scaling to smaller geometries there are increasing signs that the industry is diversifying into new device types and associated new application areas. The mainstream IC industry which is manufacturing devices such as memories and microprocessors will be following the ITRS roadmap towards smaller and smaller devices. However, in parallel, there will be an increasing activity involving the integration of silicon with other technologies and new materials, and it is clear that MEMS will form an important component of this Silicon+ activity. This paper identifies the options available for integrating MEMS with IC technology and examples will be used to identify the issues associated with their implementation through a number of examples.",

author = "Walton, {A. J.} and Stevenson, {J. T.M.} and I. Underwood and Terry, {J. G.} and S. Smith and W. Parkes and C. Dunare and H. Lin and Y. Li and R. Henderson and D. Renshaw and K. Muir and M. Desmulliez and D. Flynn and MacIntosh, {M. J.} and Holland, {W. S.} and Murray, {A. F.} and Tang, {T. B.} and A. Bunting and Gundlach, {A. M.}",

year = "2007",

month = jan,

day = "1",

language = "English",

note = "IET Seminar on Micro-Electro-Mechanical (MEMS) Technology 2007 ; Conference date: 25-04-2007 Through 25-04-2007",

}

Walton, AJ, Stevenson, JTM, Underwood, I, Terry, JG, Smith, S, Parkes, W, Dunare, C, Lin, H, Li, Y, Henderson, R, Renshaw, D, Muir, K, Desmulliez, M, Flynn, D, MacIntosh, MJ, Holland, WS, Murray, AF, Tang, TB, Bunting, A & Gundlach, AM 2007, 'Integration of IC technology with MEMS: Silicon ⁺ technology for the future', Paper presented at IET Seminar on Micro-Electro-Mechanical (MEMS) Technology 2007, London, United Kingdom, 25/04/07 - 25/04/07.

TY - CONF

T1 - Integration of IC technology with MEMS

T2 - IET Seminar on Micro-Electro-Mechanical (MEMS) Technology 2007

AU - Walton, A. J.

AU - Stevenson, J. T.M.

AU - Underwood, I.

AU - Terry, J. G.

AU - Smith, S.

AU - Parkes, W.

AU - Dunare, C.

AU - Lin, H.

AU - Li, Y.

AU - Henderson, R.

AU - Renshaw, D.

AU - Muir, K.

AU - Desmulliez, M.

AU - Flynn, D.

AU - MacIntosh, M. J.

AU - Holland, W. S.

AU - Murray, A. F.

AU - Tang, T. B.

AU - Bunting, A.

AU - Gundlach, A. M.

PY - 2007/1/1

Y1 - 2007/1/1

N2 - As silicon integrated circuits (ICs) continue their development scaling to smaller geometries there are increasing signs that the industry is diversifying into new device types and associated new application areas. The mainstream IC industry which is manufacturing devices such as memories and microprocessors will be following the ITRS roadmap towards smaller and smaller devices. However, in parallel, there will be an increasing activity involving the integration of silicon with other technologies and new materials, and it is clear that MEMS will form an important component of this Silicon+ activity. This paper identifies the options available for integrating MEMS with IC technology and examples will be used to identify the issues associated with their implementation through a number of examples.

AB - As silicon integrated circuits (ICs) continue their development scaling to smaller geometries there are increasing signs that the industry is diversifying into new device types and associated new application areas. The mainstream IC industry which is manufacturing devices such as memories and microprocessors will be following the ITRS roadmap towards smaller and smaller devices. However, in parallel, there will be an increasing activity involving the integration of silicon with other technologies and new materials, and it is clear that MEMS will form an important component of this Silicon+ activity. This paper identifies the options available for integrating MEMS with IC technology and examples will be used to identify the issues associated with their implementation through a number of examples.

UR - http://www.scopus.com/inward/record.url?scp=85042368761&partnerID=8YFLogxK

M3 - Paper

AN - SCOPUS:85042368761

Y2 - 25 April 2007 through 25 April 2007

ER -

Integration of IC technology with MEMS: Silicon ⁺ technology for the future

Abstract

Conference

Other files and links

Fingerprint

Cite this