Integration of IC technology with MEMS: Silicon + technology for the future

A. J. Walton, J. T.M. Stevenson, I. Underwood, J. G. Terry, S. Smith, W. Parkes, C. Dunare, H. Lin, Y. Li, R. Henderson, D. Renshaw, K. Muir, M. Desmulliez, D. Flynn, M. J. MacIntosh, W. S. Holland, A. F. Murray, T. B. Tang, A. Bunting, A. M. Gundlach

Research output: Contribution to conferencePaperpeer-review

2 Citations (Scopus)

Abstract

As silicon integrated circuits (ICs) continue their development scaling to smaller geometries there are increasing signs that the industry is diversifying into new device types and associated new application areas. The mainstream IC industry which is manufacturing devices such as memories and microprocessors will be following the ITRS roadmap towards smaller and smaller devices. However, in parallel, there will be an increasing activity involving the integration of silicon with other technologies and new materials, and it is clear that MEMS will form an important component of this Silicon+ activity. This paper identifies the options available for integrating MEMS with IC technology and examples will be used to identify the issues associated with their implementation through a number of examples.

Original languageEnglish
Publication statusPublished - 1 Jan 2007
EventIET Seminar on Micro-Electro-Mechanical (MEMS) Technology 2007 - London, United Kingdom
Duration: 25 Apr 200725 Apr 2007

Conference

ConferenceIET Seminar on Micro-Electro-Mechanical (MEMS) Technology 2007
Country/TerritoryUnited Kingdom
CityLondon
Period25/04/0725/04/07

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