@inproceedings{74a145e8d22c4df1a6ddad429e384fc0,
title = "Generic packaging concepts in the frame of network of excellence ePIXnet",
abstract = "Generic packaging concepts for silicon photonics have been developed in the frame of EU-funded Network of Excellence ePIXnet (FP6). Three approaches for Silicon photonic packaging will be presented within this paper. Two concepts provide solutions for fiber array coupling to high-index contrast photonic wire waveguide gratings. Third concept is the integration of inverted taper-based fiber coupling structure with silicon etched V-grooves. Using standardized SOI chip designs and commercial available assembly parts, the packaging concepts allow for small footprint or flexible use in an R\&D environment. The work presented here has resulted from cooperation within the European Network of Excellence ePIXnet.",
author = "Tolga Tekin and Lars Zimmermann and Henning Schroeder and Pieter Dumon and Wim Bogaerts and Galan, \{Jose Vicente\} and Pablo Sanchis and William Whelan-Curtin and Daryl Beggs",
year = "2010",
month = feb,
doi = "10.1117/12.842999",
language = "English",
isbn = "978-0-8194-8000-2",
volume = "7604",
series = "Proceedings of SPIE-The International Society for Optical Engineering",
publisher = "SPIE",
pages = "76040I",
editor = "JE Broquin and CM Greiner",
booktitle = "Integrated Optics: Devices, Materials, and Technologies XIV",
address = "United States",
note = "Conference on Integrated Optics - Devices, Materials, and Technologies XIV ; Conference date: 25-01-2010 Through 27-01-2010",
}