Generic packaging concepts in the frame of network of excellence ePIXnet

Tolga Tekin; Lars Zimmermann; Henning Schroeder; Pieter Dumon; Wim Bogaerts; Jose Vicente Galan; Pablo Sanchis; William Whelan-Curtin; Daryl Beggs

doi:10.1117/12.842999

Generic packaging concepts in the frame of network of excellence ePIXnet

Tolga Tekin, Lars Zimmermann, Henning Schroeder, Pieter Dumon, Wim Bogaerts, Jose Vicente Galan, Pablo Sanchis, William Whelan-Curtin, Daryl Beggs

School of Physics and Astronomy

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

Generic packaging concepts for silicon photonics have been developed in the frame of EU-funded Network of Excellence ePIXnet (FP6). Three approaches for Silicon photonic packaging will be presented within this paper. Two concepts provide solutions for fiber array coupling to high-index contrast photonic wire waveguide gratings. Third concept is the integration of inverted taper-based fiber coupling structure with silicon etched V-grooves. Using standardized SOI chip designs and commercial available assembly parts, the packaging concepts allow for small footprint or flexible use in an R&D environment. The work presented here has resulted from cooperation within the European Network of Excellence ePIXnet.

Original language	English
Title of host publication	Integrated Optics: Devices, Materials, and Technologies XIV
Subtitle of host publication	25 January 2010, San Francisco, California, USA
Editors	JE Broquin, CM Greiner
Place of Publication	BELLINGHAM
Publisher	SPIE
Pages	76040I
Number of pages	10
Volume	7604
ISBN (Print)	978-0-8194-8000-2
DOIs	https://doi.org/10.1117/12.842999
Publication status	Published - Feb 2010
Event	Conference on Integrated Optics - Devices, Materials, and Technologies XIV - San Francisco Duration: 25 Jan 2010 → 27 Jan 2010

Publication series

Name	Proceedings of SPIE-The International Society for Optical Engineering
Volume	7604
ISSN (Print)	0277-786X

Conference

Conference	Conference on Integrated Optics - Devices, Materials, and Technologies XIV
City	San Francisco
Period	25/01/10 → 27/01/10

Access to Document

10.1117/12.842999

Cite this

Tekin, T., Zimmermann, L., Schroeder, H., Dumon, P., Bogaerts, W., Galan, J. V., Sanchis, P., Whelan-Curtin, W., & Beggs, D. (2010). Generic packaging concepts in the frame of network of excellence ePIXnet. In JE. Broquin, & CM. Greiner (Eds.), Integrated Optics: Devices, Materials, and Technologies XIV : 25 January 2010, San Francisco, California, USA (Vol. 7604, pp. 76040I). (Proceedings of SPIE-The International Society for Optical Engineering; Vol. 7604). SPIE. https://doi.org/10.1117/12.842999

Tekin, Tolga ; Zimmermann, Lars ; Schroeder, Henning et al. / Generic packaging concepts in the frame of network of excellence ePIXnet. Integrated Optics: Devices, Materials, and Technologies XIV : 25 January 2010, San Francisco, California, USA. editor / JE Broquin ; CM Greiner. Vol. 7604 BELLINGHAM : SPIE, 2010. pp. 76040I (Proceedings of SPIE-The International Society for Optical Engineering).

@inproceedings{74a145e8d22c4df1a6ddad429e384fc0,

title = "Generic packaging concepts in the frame of network of excellence ePIXnet",

abstract = "Generic packaging concepts for silicon photonics have been developed in the frame of EU-funded Network of Excellence ePIXnet (FP6). Three approaches for Silicon photonic packaging will be presented within this paper. Two concepts provide solutions for fiber array coupling to high-index contrast photonic wire waveguide gratings. Third concept is the integration of inverted taper-based fiber coupling structure with silicon etched V-grooves. Using standardized SOI chip designs and commercial available assembly parts, the packaging concepts allow for small footprint or flexible use in an R&D environment. The work presented here has resulted from cooperation within the European Network of Excellence ePIXnet.",

author = "Tolga Tekin and Lars Zimmermann and Henning Schroeder and Pieter Dumon and Wim Bogaerts and Galan, {Jose Vicente} and Pablo Sanchis and William Whelan-Curtin and Daryl Beggs",

year = "2010",

month = feb,

doi = "10.1117/12.842999",

language = "English",

isbn = "978-0-8194-8000-2",

volume = "7604",

series = "Proceedings of SPIE-The International Society for Optical Engineering",

publisher = "SPIE",

pages = "76040I",

editor = "JE Broquin and CM Greiner",

booktitle = "Integrated Optics: Devices, Materials, and Technologies XIV",

address = "United States",

note = "Conference on Integrated Optics - Devices, Materials, and Technologies XIV ; Conference date: 25-01-2010 Through 27-01-2010",

}

Tekin, T, Zimmermann, L, Schroeder, H, Dumon, P, Bogaerts, W, Galan, JV, Sanchis, P, Whelan-Curtin, W & Beggs, D 2010, Generic packaging concepts in the frame of network of excellence ePIXnet. in JE Broquin & CM Greiner (eds), Integrated Optics: Devices, Materials, and Technologies XIV : 25 January 2010, San Francisco, California, USA. vol. 7604, Proceedings of SPIE-The International Society for Optical Engineering, vol. 7604, SPIE, BELLINGHAM, pp. 76040I, Conference on Integrated Optics - Devices, Materials, and Technologies XIV, San Francisco, 25/01/10. https://doi.org/10.1117/12.842999

Generic packaging concepts in the frame of network of excellence ePIXnet. / Tekin, Tolga; Zimmermann, Lars; Schroeder, Henning et al.
Integrated Optics: Devices, Materials, and Technologies XIV : 25 January 2010, San Francisco, California, USA. ed. / JE Broquin; CM Greiner. Vol. 7604 BELLINGHAM: SPIE, 2010. p. 76040I (Proceedings of SPIE-The International Society for Optical Engineering; Vol. 7604).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Generic packaging concepts in the frame of network of excellence ePIXnet

AU - Tekin, Tolga

AU - Zimmermann, Lars

AU - Schroeder, Henning

AU - Dumon, Pieter

AU - Bogaerts, Wim

AU - Galan, Jose Vicente

AU - Sanchis, Pablo

AU - Whelan-Curtin, William

AU - Beggs, Daryl

PY - 2010/2

Y1 - 2010/2

N2 - Generic packaging concepts for silicon photonics have been developed in the frame of EU-funded Network of Excellence ePIXnet (FP6). Three approaches for Silicon photonic packaging will be presented within this paper. Two concepts provide solutions for fiber array coupling to high-index contrast photonic wire waveguide gratings. Third concept is the integration of inverted taper-based fiber coupling structure with silicon etched V-grooves. Using standardized SOI chip designs and commercial available assembly parts, the packaging concepts allow for small footprint or flexible use in an R&D environment. The work presented here has resulted from cooperation within the European Network of Excellence ePIXnet.

AB - Generic packaging concepts for silicon photonics have been developed in the frame of EU-funded Network of Excellence ePIXnet (FP6). Three approaches for Silicon photonic packaging will be presented within this paper. Two concepts provide solutions for fiber array coupling to high-index contrast photonic wire waveguide gratings. Third concept is the integration of inverted taper-based fiber coupling structure with silicon etched V-grooves. Using standardized SOI chip designs and commercial available assembly parts, the packaging concepts allow for small footprint or flexible use in an R&D environment. The work presented here has resulted from cooperation within the European Network of Excellence ePIXnet.

U2 - 10.1117/12.842999

DO - 10.1117/12.842999

M3 - Conference contribution

SN - 978-0-8194-8000-2

VL - 7604

T3 - Proceedings of SPIE-The International Society for Optical Engineering

SP - 76040I

BT - Integrated Optics: Devices, Materials, and Technologies XIV

A2 - Broquin, JE

A2 - Greiner, CM

PB - SPIE

CY - BELLINGHAM

T2 - Conference on Integrated Optics - Devices, Materials, and Technologies XIV

Y2 - 25 January 2010 through 27 January 2010

ER -

Tekin T, Zimmermann L, Schroeder H, Dumon P, Bogaerts W, Galan JV et al. Generic packaging concepts in the frame of network of excellence ePIXnet. In Broquin JE, Greiner CM, editors, Integrated Optics: Devices, Materials, and Technologies XIV : 25 January 2010, San Francisco, California, USA. Vol. 7604. BELLINGHAM: SPIE. 2010. p. 76040I. (Proceedings of SPIE-The International Society for Optical Engineering). doi: 10.1117/12.842999

Generic packaging concepts in the frame of network of excellence ePIXnet

Abstract

Publication series

Conference

Access to Document

Fingerprint

Cite this