Skip to main navigation Skip to search Skip to main content

Applications of plasma technologies in recycling processes

  • Reinosuke Kusano
  • , Yukihiro Kusano*
  • *Corresponding author for this work

Research output: Contribution to journalReview articlepeer-review

Abstract

Plasmas are reactive ionised gases, which enable the creation of unique reaction fields. This allows plasmas to be widely used for a variety of chemical processes for materials, recycling among others. Because of the increase in urgency to find more sustainable methods of waste management, plasmas have been enthusiastically applied to recycling processes. This review presents recent developments of plasma technologies for recycling linked to economical models of circular economy and waste management hierarchies, exemplifying the thermal decomposition of organic components or substances, the recovery of inorganic materials like metals, the treatment of paper, wind turbine waste, and electronic waste. It is discovered that thermal plasmas are most applicable to thermal processes, whereas nonthermal plasmas are often applied in different contexts which utilise their chemical selectivity. Most applications of plasmas in recycling are successful, but there is room for advancements in applications. Additionally, further perspectives are discussed.
Original languageEnglish
Article number1687
Number of pages30
JournalMaterials
Volume17
Issue number7
DOIs
Publication statusPublished - 7 Apr 2024

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

  1. SDG 8 - Decent Work and Economic Growth
    SDG 8 Decent Work and Economic Growth
  2. SDG 12 - Responsible Consumption and Production
    SDG 12 Responsible Consumption and Production

Keywords

  • Plasma
  • Recycling
  • Thermal plasmas
  • Nonthermal plasmas
  • Circular economy
  • Plasma gasification
  • Plasma reforming

Fingerprint

Dive into the research topics of 'Applications of plasma technologies in recycling processes'. Together they form a unique fingerprint.

Cite this