A new method of manufacturing high speed aspect ratio structures using SU8 negative photoresist

S. K. Persheyev, M. J. Rose

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

SU8 Negative photoresist is finding high demand in applications such as MEMS sensors and waveguides. The possibility of photolithographic patterning and high physical and dielectric properties are attracting ever more users among workers in the electronics industry and increasingly in biomedical applications. In our work we employ an original method of exposing of SU8 and create high aspect ratio structures on glass and other substrates. Dry plasma etching results of negative epoxy-based photoresist by Inductively Coupled Plasma system using gases O2 and CF4 are presented.

Original languageEnglish
Title of host publicationIntegrated Miniaturized Materials - From Self-Assembly to Device Integration
Pages63-67
Number of pages5
Publication statusPublished - 2010
Event2010 MRS Spring Meeting - San Francisco, CA, United States
Duration: 5 Apr 20109 Apr 2010

Publication series

NameMaterials Research Society Symposium Proceedings
Volume1272
ISSN (Print)0272-9172

Conference

Conference2010 MRS Spring Meeting
Country/TerritoryUnited States
CitySan Francisco, CA
Period5/04/109/04/10

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